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LogicFolding

Huawei chip architecture that folds active logic layers vertically on top of one another so signals travel shorter distances between processing blocks.

Known aliases

  • LogicFold
  • logic folding
  • LogicFolding chipmaking technique
  • LogicFolding Tau
  • LogicFolding technique

Current stories

investOne report1 publisher

Huawei's overseas phone comeback waits on China's chip factories

Huawei is putting its consumer business behind phones on its own chips as deliveries of Huawei-powered cars slide, down 29% in September. Outside China it now sells only several million phones a year, the base from which Richard Yu wants to win back overseas share.

Publishers:cnbc.com

Reality

Evidence55
Adoption25
Hype gap+30
Incentives60
Confidence55
investConfirmed19 publishers

Huawei and Qualcomm disagree over who pays in their new patent cross-license

Qualcomm signed a multi-year patent cross-license with Huawei, a deal Huawei links to more than $6.9 billion in expected licensing value. Whether a U.S. chipmaker now pays for chip designs Huawei built under sanctions depends on terms neither company has published.

Perspective Coverage

19 publishers
Builder
Builder 32%
Operator
Operator 30%
Investor
Investor 38%

Reality

Evidence66
Adoption
Not scored
Hype gap+50
Incentives70
Confidence64
buildConfirmed2 publishers

Huawei reserves the Kirin 9050 Pro for its top Mate 90 models

Huawei's Mate 90 launch gives the Kirin 9050 Pro only to its top editions, with a Kirin 9035 in the Pro and a Kirin 9030 in the standard model. Richard Yu said smartphone chip capacity remains tight and is shared with Huawei's Ascend AI chips.

Publishers:d2233.cms.socastsrm.com economictimes.indiatimes.com en.prnasia.com mezha.net

Perspective Coverage

4 publishers
Builder
Builder 40%
Operator
Operator 29%
Investor
Investor 31%

Reality

Evidence60
Adoption30
Hype gap+30
Incentives70
Confidence60
investOne report1 publisher

Huawei claims stacked circuits deliver the density lithography would need three years to reach

Huawei's own paper puts transistor density up 53.5%, and TrendForce's relay of it does check out, but the number with money attached is Bernstein's call that Nvidia's China share falls from about 40% to 8% next year.

Reality

Evidence30
Adoption34
Hype gap+48
Incentives80
Confidence38
productOne report1 publisher

Huawei answers the heat objection to stacked logic with numbers it measured itself

Huawei's 55% density gain over the Kirin 9030 Pro was already public in July. The new ChinaXiv paper adds the power and thermal case for folding logic vertically, and nobody outside the company has checked it.

Reality

Evidence27
Adoption
Not scored
Hype gap+38
Incentives82
Confidence58