Topic
Extreme ultraviolet lithography is the semiconductor patterning technology used to print the smallest features on leading-edge chips, tightly export-controlled.
Chinese startup Langdao Silex displayed a laser-produced-plasma EUV source rated above 15W with 90% domestic components, Tom's Hardware reported. TrendForce, citing various sources, says commercializing it needs another three to five years.
Reality
ASML said on Oct 14 that its 2027 and 2028 supply will not fully meet demand even after planned 30% capacity increases in both years. Some customers are also asking to order for 2029 and 2030, which ASML calls interest, and it gave no count or value.
Perspective Coverage
17 publishersReality
Terafab will reportedly receive its first ASML EUV scanner in mid-2027, months before SemiAnalysis expects the shell of its development fab to be done. That is about three years ahead of the projected volume date at the Grimes County fab.
Reality
TSMC's September revenue rose 54.6% from a year earlier to about $16 billion. Sales were 0.6% below August's, CNBC reported, so September's faster growth rate came from a weaker year-ago month while the monthly level held near NT$512 billion.
Reality
Samsung led the 3bn euros at a mark above 21bn, ASML extended High NA commitments to Samsung and TSMC on schedules running out to 2033, and neither disclosure says how large Samsung's cheque actually was, which is the number this turns on.
Perspective Coverage
12 publishersReality
AIST researchers built a no-contact profiler that measures the absolute shape of curved mirrors to within 2 nanometres from reflected-light angles. Makers of EUV and synchrotron mirrors have found that measurement hard to take at a few nanometres without risking the surface.
Reality
Europe accounted for 0% of ASML's revenue in the first half of 2026, and the company's public affairs chief blames missing demand for European-made chips. Four European fab projects ran through the same period.
Reality
Chang Ji-hyun's team at UNIST tuned the organic ligands around tin oxide clusters and got two resists, one for throughput-priority steps and one for precision, both measured under an electron beam. The paper is a back cover in Small.
Reality
The company's own number is SRAM as dense as 2nm or 3nm logic with no extreme ultraviolet lithography, and what publicly backs it is two years of mini-fab runs inside a GlobalFoundries plant in Singapore.
Reality
Kepler Computing has $468mn, up to $245mn committed by the US Commerce Department, and mini fabs running inside GlobalFoundries, which is more than most memory startups get and still short of anything a buyer can schedule against.
Reality
The consortium's own timeline puts 12-inch masks into advanced-node production in 2033, two process generations out, which leaves Samsung's 2028 DRAM target as the one milestone close enough for a buyer to quote against.
Reality
Huawei's 55% density gain over the Kirin 9030 Pro was already public in July. The new ChinaXiv paper adds the power and thermal case for folding logic vertically, and nobody outside the company has checked it.
Reality